Thermal Stress and Strain in Microelectronics Packaging (Electrical Engineering)

by Thermal Stress

$88 · Offered by eBay · No longer available

payment | shipping rates | returns Thermal Stress and Strain in Microelectronics Packaging (Electrical Engineering) Product Category : Books ISBN : 9780442010584 Title : Thermal Stress and Strain in Microelectronics Packaging (Electrical Engineering) EAN : 9780442010584 Binding : hardcover Publisher : Springer Publication Date : 8/5/1993 12:00:01 AM Pages : 884 Signed : False First Edition : False Dust Jacket : False List Price (MSRP) : 99.00 Height : 1.6000 inches Width : 6.2000 inches Length : 9.0000 inches Weight : 2.7000 pounds Condition : Good About hpb-red Selling quality books and media since 1972. Customer service is our top priority! Payment We accept several payment types. They are shown above. Shipping Please click the "Shipping and Payments" tab above for details. Returns Your satisfaction is very important to us. Please contact us via the methods available within eBay regarding any problems before leaving negative feedback. You have 60 days from purchase to request a refund. 2026 hpb-red @media screen and (min-width: 320px) and (max-width: 800px) { #monsoon-ebay-template-light { background: #ced3b9; font-family: Arial MT, Arial, Helvetica, san-serif; font-size: 12px; color: #63635f; text-align: center; } #monsoon-ebay-template-light-header, #monsoon-ebay-template-light-header-menu, #monsoon-ebay-template-light-header-logo { height: 100px; } #monsoon-ebay-template-light-header-menu a { color: #647860; text-decoration: none; margin: 0 7px; } #monsoon-ebay-template-

• Publisher: Springer
• Year: 1993
• ISBN: 9780442010584
• Condition: Good

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