3d Microelectronic Packaging : From Architectures to Applications, Hardcover ...

Name: 3d Microelectronic Packaging : From Architectures to Applications, Hardcover ...
Price: 220.52 USD
Availability: OutOfStock
Author: Deepak Goyal

by Deepak Goyal

$221 · Offered by eBay · No longer available

Publisher: Springer
Year: 2020
Binding: Hardcover
ISBN: 9789811570896
Condition: Fine

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