Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices, Pa...

by Ephraim Suhir

$93 · Offered by eBay

Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices, Paperback by Suhir, Ephraim, ISBN 0367635887, ISBN-13 9780367635886, Like New Used, Free shipping in the US Th addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

• Publisher: CRC Press LLC
• Year: 2020
• Binding: Hardcover
• ISBN: 9780367635886
• Condition: Fine

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