Thermal and Structural Electronic Packaging Analysis for Space and Extreme: Used

Name: Thermal and Structural Electronic Packaging Analysis for Space and Extreme: Used
Price: 183.56 USD
Availability: InStock
Author: Cepeda-Rizo, Juan, and Gayle, Jeremiah, and Ravich, Joshua

by Cepeda-Rizo, Juan, and Gayle, Jeremiah, and Ravich, Joshua

$184 · Offered by eBay

Good Used Hard cover

Publisher: CRC Press
Year: 2021
Binding: Hardcover
ISBN: 1032160810
Condition: Good

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