Denshi Kiki no Kogata-ka Kousei-ka no tame no Buhin Naizou Kiban Sekkei Book

by Yoshihisa Kato

$98 · Offered by eBay

OVERVIEW This is an authentic technical reference from Japan focused on the design of embedded component substrates for miniaturization and high performance of electronic devices. It compiles the expertise of engineers to address innovations in three-dimensional mounting structures and integrated modules essential for AI edge computing and IoT applications. The material covers advanced electronic packaging techniques that improve wiring density, high-frequency characteristics, and device connection reliability. It serves as a specialized resource for engineers and researchers involved in future electronic material module substrates. SPECIFICATIONS Type: book Country/Region of Manufacture: Japan h2 {margin: 0 0 10px 0;color: #000;font-size: 22px; line-height: 1.2; text-align: left;}p, div {margin: 0; padding: 0 0 20px 0; color: #333;text-align: left;}h2 {border-left: 5px solid #1190d9; background-color: #f1f1f1; padding: 10px 20px;} Thank you for taking a look at the item we are listing. This item is a used item. If you have any questions or concerns about this item, please feel free to contact us. We also have many other items on eBay besides this one. It would be great if you could take a look at those as well. If you do not see the item you want in our listings, please contact us and we will do our best to find it for you. Please make sure you understand all of our policies, including our sales policy, before you buy. We are selling this item in accordance with eBay's polic

• Publisher: Kagaku Joho Shuppan
• Year: 2021
• Condition: Very Good

Found via Rare Books Intel, a search across rare-book dealers, auction houses and marketplaces worldwide.